XC3S500E-4FTG256C

Product Summary

The XC3S500E-4FTG256C Spartan-3E family of Field-Programmable Gate Arrays (FPGAs) is specifically designed to meet the needs of high volume, cost-sensitive consumer electronic applications. The XC3S500E-4FTG256C offers densities ranging from 100,000 to 1.6 million system gates, as shown in Table 1. The XC3S500E-4FTG256C builds on the success of the earlier Spartan-3 family by increasing the amount of logic per I/O, significantly reducing the cost per logic cell. New features improve system performance and reduce the cost of configuration. The XC3S500E-4FTG256C, combined with advanced 90 nm process technology, delivers more functionality and bandwidth per dollar than was previously possible, setting new standards in the programmable logic industry.

Parametrics

XC3S500E-4FTG256C absolute maximum ratings: (1) Internal supply voltage VCCINT: -0.5V to 1.32V; (2) Auxiliary supply voltage CCAUX: -0.5V to 3.00V; (3) Output driver supply voltage VCCO: -0.5V, VCC0 +0.5V; (4) Input reference voltage VREF: -0.5V, VCC +0.5V; (5) Voltage applied to all User I/O pins and Dual-Purpose pins VIN: -0.5V, VCC +0.5V; (6) Electrostatic Discharge Voltage VESD: -2000V to +2000V (Human body mode) , -500V t0 +500V (Charged device model) , -200V to +200V (Machine model) ; (7) Junction temperature Tj: 125°C; (8) Storage temperature Tstg: -65°C to 150°C.

Features

XC3S500E-4FTG256C features: (1) Very low cost, high-performance logic solution for high-volume, consumer-oriented applications; (2) Proven advanced 90-nanometer process technology; (3) Multi-voltage, multi-standard SelectIO? interface pins, (a) Up to 376 I/O pins or 156 differential signal pairs, (b) LVCMOS, LVTTL, HSTL, and SSTL single-ended signal standards, (c) True LVDS, RSDS, mini-LVDS differential I/O, (d) 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling, 5) Enhanced Double Data Rate (DDR) support; (4) Abundant, flexible logic resources: (a) Densities up to 33, 192 logic cells, including optional shift register or distributed RAM support, (b) Efficient wide multiplexers, wide logic, (c) Fast look-ahead carry logic, (d) Enhanced 18 x 18 multipliers with optional pipeline, (e) IEEE 1149.1/1532 JTAG programming/debug port; (5) Hierarchical SelectRAM? memory architecture: (a) Up to 648 Kbits of fast block RAM, (b) Up to 231 Kbits of efficient distributed RAM; (6) Up to eight Digital Clock Managers (DCMs) : a) Clock skew elimination (delay locked loop) , (b) Frequency synthesis, multiplication, division, (c) High-resolution phase shifting; (7) Eight global clocks and eight clocks for each half of device, plus abundant low-skew routing; (8) Configuration interface to industry-standard PROMs: (a) Low-cost, space-saving SPI serial Flash PROM, (b) x8 or x8/x16 parallel NOR Flash PROM, (c)Low-cost Xilinx Platform Flash with JTAG;(9) Complete Xilinx ISE, WebPACK development system support; (10) MicroBlaze, PicoBlaze embedded processor cores; (11) Fully compliant 32-/64-bit 33/66 MHz PCI support; (12) Low-cost QFP and BGA packaging options:1)Common footprints support easy density migration,2) Pb-free packaging option.

Diagrams